SEIKO INSTRUMENTS INC (SII) 0821-81-49B DAC PB 6U VME MODULE (USED) 實際應用的軟起動系統，通常是采用電流互感器取得反饋信號，經整流、濾波等信號處理環節，以獲得如實反映起動電流（般為有效值）的信號，實現起來并不簡單，而在仿真建模中，卻可輕易獲取起動電流的有效值，因為也是在附加模塊庫中，測量子庫（MeasuremaUs）提供了有效值，測量模塊（RMS）可直接加以利用，十分方便。
軟起動本質是降壓起動，關鍵在于限制起動電流。實現的過程是起動電壓由某給定電壓值逐步升高，至所給定的限制電流之后保持恒定，在此恒定起動電壓下過高的電流開始衰減后，起動電壓再繼續上升，如此這般終達到額定全壓。據此建立的封裝模塊內部模型如所示，輸入的電流反饋信號iback和限流給定值iref通過加法器進行比較，電流偏差經滯環比較（Relay），若反饋信號大于給定值，輸出為0，反之則輸出為.電壓上升速率控制uincr值與滯環輸出相乘后，通過積分環節，產生值由0按上升斜率為其乘積值線性遞增的信號，乘積值為0時，積分環節輸出即保持原有值不變。起動電壓起始給定值uini和積分輸出值比較，偏差經飽和環節（Saturation）限制輸出值范圍，送至輸出端。uini和飽和輸出范圍的取值都表示觸發角a的大小。
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